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| application INFO available UC1706 UC2706 UC3706 Dual Output Driver FEATURES * * * * * * * * * * * * * Dual, 1.5A Totem Pole Outputs 40nsec Rise and Fall into 1000pF Parallel or Push-Pull Operation Single-Ended to Push-Pull Conversion High-Speed, Power MOSFET Compatible Low Cross-Conduction Current Spike Analog, Latched Shutdown Internal Deadband Inhibit Circuit Low Quiescent Current 5 to 40V Operation Thermal Shutdown Protection 16-Pin Dual-In-Line Package 20-Pin Surface Mount Package DESCRIPTION The UC1706 family of output drivers are made with a high-speed Schottky process to interface between low-level control functions and high-power switching devices - particularly power MOSFET's. These devices implement three generalized functions as outlined below. First: They accept a single-ended, low-current digital input of either polarity and process it to activate a pair of high-current, totem pole outputs which can source or sink up to 1.5A each. Second: They provide an optional single-ended to push-pull conversion through the use of an internal flip-flop driven by double-pulsesuppression logic. With the flip-flop disabled, the outputs work in parallel for 3.0A capability. Third: Protection functions are also included for pulse-by-pulse current limiting, automatic deadband control, and thermal shutdown. These devices are available in a two-watt plastic "bat-wing" DIP for operation over a 0C to 70C temperature range and, with reduced power, in a hermetically sealed cerdip for -55C to +125C operation. Also available in surface mount Q and L packages. TRUTH TABLE INV H L H L N.I H H L L OUT L H L L OUT = INV and N.I. OUT = INV or N.I. BLOCK DIAGRAM SLUS200A - OCTOBER 1998 - REVISED APRIL 2001 UC1706 UC2706 UC3706 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N--Pkg . . . . . . . . . . . . . . . J--Pkg Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . 40V Collector Supply Voltage, VC . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . 40V Output Current (Each Output, Source or Sink) Steady--State . . . . . . . . . . . . . . . . . . . . . . . . . . 500mA. . . . . . . . . . . . . . . 500mA Peak Transient . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5A. . . . . . . . . . . . . . . . . 1.0A Capacitive Discharge Energy . . . . . . . . . . . . . . . 20J. . . . . . . . . . . . . . . . . . 15J . Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V . . . . . . . . . . . . . . . . . 5.5V Analog Stop Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . VIN. . . . . . . . . . . . . . . . . . . VIN . Power Dissipation at TA = 25C (See Note) . . . . . . . 2W . . . . . . . . . . . . . . . . . . 1W Power Dissipation at T (Leads/Case) = 25C . . . . . . 5W . . . . . . . . . . . . . . . . . . . 2 (See Note) Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . --55C to +125C Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . --65C to +150C Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . . . . . . . 300C Note: All voltages are with respect to the four ground pins which must be connected together. All currents are positive into, negative out of the specified trerminal. Consult Packaging sections of the Databook for thermal limitations and considerations of package. CONNECTION DIAGRAMS DIL-16, SOIC-16 (TOP VIEW) J or N Package, DW Package PLCC-20, LCC-20 (TOP VIEW) Q, L Packages N/C B INHIBIT INV. INPUT N.I. INPUT GROUND GROUND A OUTPUT FLIP/FLOP VC 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 A INHIBIT INHIBIT REF VIN GROUND GROUND B OUTPUT STOP NON-INV. STOP INV. B INHIBIT INV INPUT 3 N.I.INPUT GROUND N/C GROUND A OUTPUT FLIP/FLOP VC 4 5 6 7 8 9 10 11 12 13 2 1 20 19 18 17 16 15 14 A INHIBIT INHIBIT REF VIN GROUND N/C GROUND B OUTPUT STOP INV. STOP NON-INV. N/C Note: All four ground pins must be connected to a common ground. ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA = -55C to +125C for the UC1706, -25C to +85C for the UC2706 and 0C to +70C for the UC3706; VIN = VC = 20V. TA = TJ. PARAMETERS VIN Supply Current VC Supply Current VC Leakage Current Digital Input Low Level Digital Input High Level Input Current Input Leakage VI = 0 VI = 5V 2.2 -0.6 .05 -1.0 0.1 VIN = 40V VC = 40V, Outputs Low VIN = 0, VC = 30V, No Load TEST CONDITIONS MIN TYP 8 4 .05 MAX 10 5 0.1 0.8 UNITS mA mA mA V V mA mA 2 UC1706 UC2706 UC3706 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA = -55C to +125C for the UC1706, -25C to +85C for the UC2706 and 0C to +70C for the UC3706; VIN = VC = 20V. TA = TJ. PARAMETERS Output High Sat., VC-VO Output Low Sat., VO Inhibit Threshold Inhibit Input Current Analog Threshold Input Bias Current Thermal Shutdown IO = -50mA IO = 50mA IO = 500mA VREF = 0.5V VREF = 3.5V VREF = 0 VCM = 0 to 15V, for the UC2706 and UC3706 VCM = 0 to 15V, for the UC1706 VCM = 0 100 80 0.4 3.3 -10 130 130 -10 155 TEST CONDITIONS MIN TYP MAX 2.0 0.4 2.5 0.6 3.7 -20 160 160 -20 UNITS V V V V V A mV mV A C TYPICAL SWITCHING CHARACTERISTICS: VIN = VC = 20V, TA = 25C. Delays measured to 10% output change. PARAMETERS From Inv. Input to Output: Rise Time Delay 10% to 90% Rise Fall Time Delay 90% to 10% Fall From N. I. Input to Output: Rise Time Delay 10% to 90% Rise Fall Time Delay 90% to 10% Fall VC Cross-Conduction Current Spike Duration Output Rise Output Fall Inhibit Delay Analog Shutdown Delay Inhibit Ref. = 1V, Inhibit Inv. = 0.5 to 1.5V Stop Non-Inv. = 0V, Stop Inv. = 0 to 0.5V 120 20 100 25 25 0 250 180 130 40 120 30 140 60 130 50 ns ns ns ns ns ns ns ns TEST CONDITIONS OUTPUT CL = open 110 20 80 25 1.0 130 40 90 30 2.2 140 60 110 50 UNITS nF ns ns ns ns CIRCUIT DESCRIPTION Outputs The totem-pole outputs have been designed to minimize cross-conduction current spikes while maximizing fast, high-current rise and fall times. Current limiting can be done externally either at the outputs or at the common VC pin. The output diodes included have slow recovery and should be shunted with high-speed external diodes when driving high-frequency inductive loads. Flip/Flop Grounding pin 7 activates the internal flip-flop to alternate the two outputs. With pin 7 open, the two outputs operate simultaneously and can be paralleled for higher current operation. Since the flip-flop is triggered by the digital input, an off-time of at last 200nsec must be provided to allow the flip/flop to change states. Note that the circuit logic is configured such that the "OFF" state is defined as the outputs low. Digital Inputs With both an inverting and non-inverting input available, either active-high or active-low signals may be accepted. These are true TTL compatible inputs--the threshold is approximately 1.2V with no hysteresis; and external pullup resistors are not required. Inhibit Circuit Although it may have other uses, this circuit is included to eliminate the need for deadband control when driving relatively slow bipolar power transistors. A diode from each inhibit input to the opposite power switch collector will keep one output from turning-on until the other has turned-off. The threshold is determined by the voltage on pin 15 which can be set from 0.5 to 3.5V. When this circuit is not used, ground pin 15 and leave 1 and 16 open. 3 CIRCUIT DESCRIPTION (cont.) Analog Shutdown This circuit is included to get a latched shutdown as close to the outputs as possible, from a time standpoint. With an internal 130mV threshold, this comparator has a common-mode range from ground to (VIN - 3V). When not used, both inputs should be grounded. The time required for this circuit to latch is inversely proportional to the amount of overdrive but reaches a minimum of 180nsec. As with the flip-flop, an input off-time of at least 200nsec is required to reset the latch between pulses. Supply Voltage With an internal 5V regulator, this circuit is optimized for UC1706 UC2706 UC3706 use with a 7 to 40V supply; however, with some slight response time degradation, it can also be driven from 5V. When VIN is low, the entire circuit is disabled and no current is drawn from VC. When combined with a UC1840 PWM, the Driver Bias switch can be used to supply VIN to the UC1706. VIN switching should be fast as if VC is high, undefined operation of the outputs may occur with VIN less than 5V. Thermal Considerations Should the chip temperature reach approximately 155C, a parallel, non--inverting input is activated driving both outputs to the low state. APPLICATIONS D1, D2; UC3611 Schottky Diodes Power MOSFET Drive Circuit D1, D2; UC3611 Schottky Diodes Power MOSFET Drive Circuit Using Negative Bias Voltage and Level Shifting to Ground Referenced PWMs D1, D2: UC3611 Schottky Diodes Transformer Coupled MOSFET Drive Circuit Charge Pump Circuits 4 APPLICATIONS (cont'd) UC1706 UC2706 UC3706 D1, D2: UC3611 Schottky Diodes Power Bipolar Drive Circuit D1, D2: UC3611 Schottky Diodes Transformer Coupled Push-Pull MOSFET Drive Circuit UC3706 Converts Single Output PWMs to High Current Push-Pull Configuration UNITRODE CORPORATION 7 CONTINENTAL BLVD. * MERRIMACK, NH 03054 TEL. (603) 424-2410 * FAX (603) 424-3460 5 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such products or services might be or are used. TI's publication of information regarding any third party's products or services does not constitute TI's approval, license, warranty or endorsement thereof. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations and notices. Representation or reproduction of this information with alteration voids all warranties provided for an associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use. Resale of TI's products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use. Also see: Standard Terms and Conditions of Sale for Semiconductor Products. www.ti.com/sc/docs/stdterms.htm Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2001, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such products or services might be or are used. TI's publication of information regarding any third party's products or services does not constitute TI's approval, license, warranty or endorsement thereof. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations and notices. Representation or reproduction of this information with alteration voids all warranties provided for an associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use. Resale of TI's products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use. Also see: Standard Terms and Conditions of Sale for Semiconductor Products. www.ti.com/sc/docs/stdterms.htm Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2001, Texas Instruments Incorporated |
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